Apple has entered into a multi-year agreement with Broadcom valued at $30 billion to design and manufacture custom silicon components and advanced wireless connectivity technologies in the United States.
The partnership, announced on Wednesday, marks a significant expansion of Apple’s domestic manufacturing footprint and deepens its reliance on Broadcom for critical connectivity hardware across its product lineup.
The deal is expected to result in the production of more than 15 billion chips in the US over its lifespan.
The deal is expected to result in the production of more than 15 billion chips in the US over its lifespan.
This volume underscores the scale of Apple’s connectivity requirements and signals a strategic shift toward onshoring key semiconductor operations.
For Broadcom, the agreement represents a major long-term revenue commitment and reinforces its position as a leading supplier of specialized silicon for consumer electronics.
The announcement aligns with broader industry trends toward supply chain resilience and domestic production incentives.