Chinese AI chip startup Dongfang Suanxin exits stealth, targets 3D stacking to bypass US controls

The move signals deepening domestic efforts to circumvent export restrictions as Beijing accelerates its push for AI infrastructure independence.

By Handelsavisen Newsroom · Automated 2026-07-05 04:03 UTC · 1 min read

Dongfang Suanxin, a Chinese artificial intelligence chip developer, has emerged from stealth mode with a strategy centered on 3D stacking technology.

The startup aims to use this advanced packaging method to navigate US export controls that have restricted access to high-end semiconductor manufacturing equipment and design tools.

Led by Wei Shaojun, who also serves as vice-president of the China Semiconductor Industry Association, the company joins industry heavyweight Huawei Technologies in betting on 3D stacking as a viable workaround for US tech restrictions.

This approach allows for greater computational density without relying on the most advanced lithography nodes that are currently under strict export scrutiny.

The launch underscores the intensifying race for AI self-sufficiency in China.

Reports indicate that Beijing is systematically preparing to displace US giants such as Nvidia, Anthropic, and OpenAI from its domestic AI infrastructure.