Samsung Electronics and SK Hynix are moving forward with plans to construct new high-bandwidth memory (HBM) packaging facilities in South Korea's central Chungcheong region.
The projects represent a significant expansion of domestic capacity for the critical memory technology powering artificial intelligence hardware.
The move comes as both companies have committed a combined $520 billion to new semiconductor fabrication plants, underscoring the massive scale of the ongoing infrastructure buildout.
The combined investment totals W392 trillion, reflecting the intense capital expenditure required to maintain leadership in the advanced memory market.
This development aligns with the broader strategic push by South Korean semiconductor giants to secure their position in the global AI supply chain.
The move comes as both companies have committed a combined $520 billion to new semiconductor fabrication plants, underscoring the massive scale of the ongoing infrastructure buildout.
The focus on HBM packaging specifically highlights the bottleneck in AI chip production, where advanced packaging is often the limiting factor in supply.