Samsung, SK Hynix to build HBM packaging hubs in Chungcheong as part of $252.5 billion regional push

The latest phase of South Korea's semiconductor expansion targets high-bandwidth memory packaging, reinforcing the country's role in the global AI infrastructure supply chain.

By Handelsavisen Newsroom · Automated 2026-07-02 01:25 UTC · 1 min read

Samsung Electronics and SK Hynix are set to construct new high-bandwidth memory (HBM) packaging facilities in South Korea's central Chungcheong region, according to reports from Yonhap.

The projects form part of a broader industry-wide investment totaling 392 trillion won ($252.5 billion) aimed at bolstering the area's semiconductor manufacturing capabilities.

This development follows earlier commitments by both memory giants to build new fabrication plants, with combined investments previously reported at approximately $520 billion.

The move underscores the intensifying competition for AI chip production capacity.

While previous announcements focused on fabrication plants, this latest commitment specifically targets the packaging stage, a critical bottleneck in the supply chain for advanced memory modules used in artificial intelligence accelerators.

The investment signals a strategic deepening of South Korea's vertical integration in the semiconductor sector.

This development follows earlier commitments by both memory giants to build new fabrication plants, with combined investments previously reported at approximately $520 billion.