SK Hynix has announced plans to invest approximately $51.46 billion (80 trillion won) to construct a new factory dedicated to NAND memory chip production, with completion targeted for 2029.
The South Korean semiconductor giant also revealed a secondary investment of $14.4 billion (20 trillion won) for a new chip packaging facility in Cheongju, scheduled to be operational by late 2027.
4 billion through a listing of American depositary receipts on the Nasdaq.
The dual announcements underscore SK Hynix’s strategy to expand its manufacturing footprint and secure long-term capacity in the memory market.
The NAND facility represents a significant capital commitment, reflecting the company’s confidence in sustained demand for storage solutions.
The accompanying packaging plant in Cheongju will support advanced packaging technologies, which are increasingly critical for high-performance computing and AI applications.
This expansion comes shortly after SK Hynix confirmed plans to raise up to $29.4 billion through a listing of American depositary receipts on the Nasdaq.