Major US technology firms are increasingly turning to international bond markets to finance their rapid expansion of artificial intelligence infrastructure.
The shift marks a significant evolution in corporate financing strategies, as companies seek to fund massive capital expenditures on chips and cloud infrastructure without diluting equity or depleting cash reserves.
Amazon.com Inc. is preparing to raise at least $25 billion through a US dollar bond offering, a move that signals the scale of the e-commerce and cloud computing giant's ambitions.
This trend is reshaping the global corporate debt landscape, with tech giants becoming some of the most active issuers in recent memory.
Amazon.com Inc. is preparing to raise at least $25 billion through a US dollar bond offering, a move that signals the scale of the e-commerce and cloud computing giant's ambitions.
The issuance is expected to be one of the largest corporate debt deals in recent history, underscoring the immense capital requirements of the AI buildout.
Oracle has also joined the ranks of major issuers, leveraging its strong balance sheet to secure funding for data center construction and expansion.