Samsung and SK hynix expand memory roadmap beyond HBM as AI demand outpaces supply

The shift signals that AI infrastructure needs are broadening, prompting South Korea's chip leaders to diversify production beyond high-bandwidth memory.

By Handelsavisen Newsroom · Automated 2026-07-20 06:22 UTC · 1 min read

Samsung Electronics and SK hynix are advancing development of new memory layers to address artificial intelligence workloads that exceed the capacity of high-bandwidth memory (HBM) alone.

The move indicates that the AI infrastructure buildout is evolving beyond a single memory standard, requiring a more diversified supply chain to meet growing computational demands.

Samsung and SK hynix have committed a combined $520 billion to construct new semiconductor fabrication plants, underscoring the massive capital intensity of the current AI cycle.

This strategic pivot comes as the two South Korean giants continue to scale their manufacturing footprint.

Samsung and SK hynix have committed a combined $520 billion to construct new semiconductor fabrication plants, underscoring the massive capital intensity of the current AI cycle.

The companies are also moving forward with plans to build new HBM packaging facilities in South Korea's central Chungcheong region, reinforcing their dominance in the high-performance memory segment.

The expansion reflects a broader industry trend where AI models are becoming increasingly complex, driving demand for memory solutions that complement HBM.