Samsung Electronics has announced a strategic partnership with U.S. chip designer Broadcom valued at more than $200 billion.
The agreement, disclosed on Saturday, expands cooperation across memory chips, contract chip manufacturing, and advanced packaging technologies.
This represents one of the largest collaborative deals in the semiconductor industry, underscoring Samsung's aggressive push to capture a larger share of the artificial intelligence infrastructure market.
The partnership is expected to provide a significant boost to Samsung's foundry business, which has been working to close the technology gap with rival TSMC.
By securing a long-term commitment from a major AI chip designer like Broadcom, Samsung gains visibility into future demand and a stable revenue stream for its advanced packaging and memory solutions.
The deal also highlights the growing importance of co-design and integrated supply chains in the development of next-generation AI accelerators.